Baoji Yusheng Hlau Technology Co., Ltd. tshwj xeeb hauv kev tshawb fawb thiab tsim khoom ntawmtantalum sputtering lub hom phiajthiab cov khoom siv nqus tsev vacuum. Txij li thaum tantalum muaj peev xwm tsim oxide zaj duab xis thiab muaj kev tiv thaiv zoo, tantalum lub hom phiaj yog dav siv los ua substrates rau kev tsim cov electrolytic capacitors. Lub sijhawm no, daim ntawv thov ntawm tantalum sputtering lub hom phiaj hauv thaj chaw ntawm microelectronics tau qhia.
Tantalum Targets rau Thermal Inkjet Printhead Daim Ntawv Thov
Thermal inkjet printheads tuaj yeem siv rau hauv kev tsim cov yeeb yaj kiab sib xyaw ua ke, uas pab txhawb kev siv cov hom phiaj tantalum. Hauv kev tsim cov txheej txheem tsim ntawm cov khoom siv sib xyaw ua ke, cov khoom ua yeeb yaj kiab nyias nyias ntawm cov number case ntawm lub taub hau nrog cov kua ntses loj heev, uas yog qhov me me Ink droplets ejected. . Txij li thaum kub-kub inks tuaj yeem ua rau cavitation hauv qee cov khoom siv inkjet luam ntawv, kev siv cov tantalum anti-cavitation films tuaj yeem tiv thaiv cov number case installation.
Tantalum Targets rau tooj liab plating
Tantalum nyias zaj duab xis muaj cov txiaj ntsig zoo hauv kev tsim cov txheej txheem sib xyaw ua ke. Ib qho kev nce qib loj hauv kev siv tantalum sputtering lub hom phiaj yog kev siv tooj liab plating. Photoresist lub qhov ncauj qhov ntswg thiab plasma etching cov tswv yim tsis tuaj yeem siv los ua tooj liab vim tooj liab nyob rau hauv qhov kub thiab txias plasma etching tej yam kev mob. Qhov xav tau volatile constituents tsis tsim. Feem ntau, lub siab conductivity ntawm cov ntaub ntawv tooj liab ua rau nws tsim nyog rau lub barrier zaj duab xis kom cais tag nrho cov tooj liab. Txawm li cas los xij, yog tias cov yeeb yaj kiab barrier yog tuab heev, qhov zoo ntawm cov khoom siv hluav taws xob zoo ntawm cov tooj liab sib cuam tshuam tau ploj mus. Yog li ntawd, nws yog ib qho tseem ceeb uas lub deposition ntawm barrier zaj duab xis nyob rau hauv lub tooj liab plating tswv yim muaj zoo kauj ruam kev pab them nqi thiab txo protrusions ntawm lub viav vias / trench voids. Hauv kev hloov 0.10um tooj liab ICs, tantalum thiab nitric oxide PVD barrier films qhia qee qhov zoo, xws li tooj liab diffusion zoo thiab adhesion zoo rau electrolytes thiab tooj liab.
Cov99.98% tantalum lub hom phiajuas tsim los ntawm Baoji Yusheng Hlau Technology Co., Ltd. yog feem ntau siv los ua cua sov qhov chaw, qhov hluav taws xob rwb thaiv tsev, thiab cov thawv ntim rau lub tshuab nqus tsev vacuum. Lub hom phiaj tantalum tsim los ntawm peb lub tuam txhab tsis tuaj yeem siv los ua cov substrates hauv kev lag luam tshuaj. , aerospace kev lag luam, khoom siv kho mob, thiab lwm yam.
