High-Purity Tantalum Sputtering Target

In recent years, with the rapid development of the electronic information industry, sputtering targets for integrated circuits have also been greatly developed. Among the metal targets used to manufacture semiconductor chips, common sputtering targets are non-ferrous metals such as Ta Ti Al Co and Cu. Among them, the largest amount of metal sputtering targets for integrated circuit manufacturing is ultra-high purity aluminum (>99.999 feem pua) thiab ultra-siab purity aluminium alloy lub hom phiaj, thiab lub hom phiaj ultra-siab purity titanium siv rau sputtering barrier txheej yog ultra-siab purity titanium phiaj. Hauv LSIs, hlau interconnect electromigration yog ib qho ntawm cov txheej txheem tseem ceeb. Ntawm qhov ceev tam sim no, txhuas hlau yog nquag mus rau electromigration, uas ua rau tsim ntawm protrusions thiab voids nyob rau hauv lub txhuas interconnect zaj duab xis, yog li txo cov kev khiav hauj lwm efficiency thiab kev cia siab ntawm kev sib txuas circuits. Lub resistivity ntawm Cu yog li ntawm 35 feem pua ​​​​qis dua li ntawm Al, thiab kev tiv thaiv rau electromigration kuj muaj zog; Thiab nrog rau qhov kev loj hlob ntawm kev sib xyaw ua ke, qhov kev sib xyaw ua ke tau nce siab dua thiab siab dua, thiab cov kev xav tau siab dua tau muab tso rau pem hauv ntej rau kev tsim cov sputtering lub hom phiaj rau cov txheej txheem interline thiab teeb meem, hauv cov txheej txheem sib sib zog nqus submicron (tsawg dua lossis sib npaug. 018um), tooj liab yuav maj mam hloov txhuas raws li cov khoom siv rau metallized thaiv ntawm silicon wafers, ultra-siab purity tooj liab lub hom phiaj yuav siv tau ntau dua, thiab cov sputtering ntawm tus txiv neej barrier yog lub hom phiaj siab purity tantalum.

Nrog rau kev nce qib ntawm high-purity tantalum lub hom phiaj raws li sputter barrier txheej cov khoom, nws cov kev xav tau rau lub hom phiaj kev ua tau zoo kuj tau txais ntau dua thiab siab dua, xws li qhov loj thiab loj dua sputtering lub hom phiaj loj, lub finer thiab ntau uniform microstructure, thiab lwm yam. . Yog li ntawd, kev tshawb fawb ntawm cov txheej txheem kev npaj ntawm sputtering lub hom phiaj tau maj mam nyiam. Tam sim no, cov txheej txheem kev npaj ntawm high-purity tantalum sputtering lub hom phiaj feem ntau suav nrog smelting thiab casting txoj kev thiab hmoov metallurgy txoj kev:

1.Kev npaj ntawm high-purity sputtering lub hom phiaj los ntawm smelting thiab casting txoj kev

Txoj kev smelting thiab casting tam sim no yog txoj hauv kev tseem ceeb rau kev npaj tantalum sputtering lub hom phiaj, feem ntau cov tantalum raw cov ntaub ntawv yog smelted (electron beam los yog arc, plasma melting, thiab lwm yam) forging, thiab cov tau ingots los yog blanks rov qab kub forged, annealed, thiab ces dov, annealed, thiab tiav rau hauv lub hom phiaj. Cov ingots los yog blanks yog kub forged los rhuav tshem cov qauv casting, kom lub pores los yog segregation diffuse, ploj, thiab ces recrystallize lawv los ntawm annealing, yog li txhim kho cov densification thiab lub zog ntawm cov ntaub so ntswg.

Txhawm rau kom ntseeg tau tias lub hom phiaj muaj peev xwm sputter cov yeeb yaj kiab zoo, feem ntau muaj cov kev xav tau siab rau tantalum sputtering lub hom phiaj, thiab qhov siab dua ntawm cov khoom siv lub hom phiaj, qhov zoo ntawm cov yeeb yaj kiab zoo.

2. Kev npaj ntawm high-purity tantalum sputtering lub hom phiaj los ntawm hmoov metallurgy

Cov txheej txheem rau kev npaj siab purity tantalum lub hom phiaj los ntawm cov hmoov hlau metallurgy feem ntau suav nrog kub nias, kub isostatic nias, txias isostatic nqus tsev sintering, thiab lwm yam. Tam sim no, ntau hom hmoov metallurgy npaj tantalum sputtering phiaj txoj kev yog tsuas yog kub nias thiab kub isostatic nias txoj kev. , los ntawm nitriding saum npoo ntawm cov hmoov hlau, tantalum hmoov nrog cov ntsiab lus oxygen hauv qab 300mg / kg thiab nitrogen cov ntsiab lus hauv qab 10mg / kg tuaj yeem tau, thiab tom qab ntawd thauj mus rau hauv pwm, thiab tom qab ntawd txias-nias txoj kev thiab kub isostatic nias molding lossis lwm yam. sintering txoj kev, purity ntawm 99.95 feem pua ​​los yog ntau tshaj, qhov nruab nrab grain loj yog tsawg tshaj li 50um, los yog txawm 10um, kev ntxhib los mos yog random, thiab kev ntxhib los mos uniform tantalum lub hom phiaj nyob rau saum npoo thiab thickness ntawm lub hom phiaj.

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